Eero Router Heat Disconnect Experiment

During the hot summer weather in Prince Edward Island, my Eastlink Eero Pro 6E Mesh router frequently lost internet access. I initially considered buying a heat sink, but my dad suggested this was a great opportunity to practice my skills and suggested I use materials I already had at home to solve the problem. I tried three methods: covering it with ice packs, covering it with an ice bottle, and using an ice bottle as a base.

This project is by 陶乘风/Charles Tao

1. Background

Location: Prince Edward Island (PEI), Canada

Device: Eastlink Eero Pro 6E (one in the garage, one on a low cabinet on the second floor)

Problem: The room temperature rises significantly during the summer midday and afternoon, causing the router to frequently disconnect from the internet due to poor heat dissipation.

Constraints: Purchasing additional semiconductor heat sinks is not an option; we need to use household materials.

2. Problem Analysis

The Eero Pro 6E relies on passive cooling through its outer casing and internal metal structure. When the ambient temperature is too high and air circulation is poor, heat cannot be dissipated quickly, causing the internal temperature of the device to continue to rise, eventually triggering performance protection mechanisms and causing network outages.

In addition, the garage and the low cabinets on the second floor are not adequately ventilated and are surrounded by obstructions, further exacerbating the overheating problem.

（This eero‘s inside picture is from https://www.reddit.com/answers/66ec66e1-0d5e-4c99-a69d-783f986557ce/?q=Eero%20firmware%20updates%20impact%20on%20speed&source=PDP）

3. Experimental Plan and Improvement Process

Phase 1: Preliminary Plan (Ice Pack Covering the Top)

Materials: Ice pack, paper towel.

Instructions: Wrap the ice pack in a paper towel and place it directly on top of the Eero to quickly reduce the temperature.

Advantages:

1. Rapid cooling, achieving a noticeable reduction in temperature within minutes.

2. Materials are readily available and easy to use.

Disadvantages:

1. Condensation accumulates on the surface of the ice pack, and the paper towel's limited waterproofing ability creates a risk of water seepage.

2. Placing the top of the device will restrict airflow.

3. The weight of the ice pack may damage the device's casing.

4. Sudden temperature fluctuations may damage internal solder joints or chips.

Phase 2: Interim Plan (Plastic Bottle Filled with Ice Cubes Covering the Top)

Materials: Plastic bottle, ice cubes.

Instructions: Fill a plastic bottle with water, freeze it into an ice bottle, and place it directly on top of the Eero to cool it.

Advantages:

1. The cooling effect lasts longer and is more stable. 2. The ice bottle is reusable and low-cost.

Disadvantages:

1. Frost on the ice bottle causes more condensation.

2. Top-mounted placement still results in ventilation.

3. Weight and temperature difference issues still exist.

Phase 3: Final Solution (Ice bottle placed underneath for protection)

Materials: Plastic bottle (ice cubes), paper towels, thin towels.

Instructions: Place the ice bottle under the Eero, topped with a layer of paper towels (to absorb moisture) and a thin towel (to prevent moisture and provide cushioning), then place the Eero. This allows for indirect transfer of cooling from the bottom.

Advantages:

1. The ice bottle is not in direct contact with the device, reducing temperature shock.

2. The top is unobstructed, allowing for smooth circulation of hot air.

3. The paper towels and towels effectively prevent condensation.

4. The structure is stable and will not damage the device.

Disadvantages:

1. Cooling speed is slower than with a direct cover.

2. The ice bottle needs to be replaced regularly after it thaws.

4. Results Comparison

Phase Solution Cooling Speed ​​Duration Safety Convenience

Ice Pack Coverage ★★★★★ ★★☆☆☆ ★☆☆☆☆ ★★★★☆

Ice Bottle Coverage ★★★★☆ ★★★★☆ ★★☆☆☆ ★★★☆☆

Ice Bottle Base ★★★☆☆ ★★★★☆ ★★★★★ ★★★☆☆

5. Conclusion and Reflection

Through three rounds of improvements, I gradually shifted from a "rapid cooling" solution to one that provides "safety, stability, and long-term usability."

When cooling electronic equipment, humidity control and air circulation are just as important as temperature.

Indirect heat transfer can effectively reduce temperature shock and the risk of condensation.

Even with limited resources, a suitable solution can be found through continuous improvement.

Future Optimization Directions:

Add a small USB fan to the final solution to improve air circulation.

Use a metal plate instead of a towel to improve thermal conductivity.