BGA REWORK STENCIL

BGA REWORK STENCIL

The Stenciling System is very simple to use.

This device will make your rework faster and simpler. This breakthrough method allows you to simplify the placement/replacement of both area array devices such as BGAs and CSPs as well as other leaded SMT devices.

For more information on BGA Rework Stencils visit on www.soldertools.net